Product

TO-CAN OEM

TO-CAN OEM

Description
APAC provides assembly and testing service for TO-CAN type package.

It includes die bond, wire bond and cap sealing process.

Both eutectic and epoxy process are available for die attachment,

and both ball bond and wedge bond could be applied at wire bond process.

Active alignment could be used to improve the capping accuracy.

The final products could be screened by burn-in system.
Specification

TO Type Product Package Data Rate
TO-46 PINTIA Ball & Flat Window 155M ~10G
APDTIA
LED
VCSEL

TO Type Product Package Data Rate
TO-56 FP LD Aspherical, Ball, Flat Window, 155M ~10G
DFB LD