TO-CAN OEM
APAC provides assembly and testing service for TO-CAN type package.
It includes die bond, wire bond and cap sealing process.
Both eutectic and epoxy process are available for die attachment,
and both ball bond and wedge bond could be applied at wire bond process.
Active alignment could be used to improve the capping accuracy.
The final products could be screened by burn-in system.
It includes die bond, wire bond and cap sealing process.
Both eutectic and epoxy process are available for die attachment,
and both ball bond and wedge bond could be applied at wire bond process.
Active alignment could be used to improve the capping accuracy.
The final products could be screened by burn-in system.
Specification
| TO Type | Product | Package | Data Rate |
| TO-46 | PINTIA | Ball & Flat Window | 155M ~10G |
| APDTIA | |||
| LED | |||
| VCSEL |
| TO Type | Product | Package | Data Rate |
| TO-56 | FP LD | Aspherical, Ball, Flat Window, | 155M ~10G |
| DFB LD |
